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http://inaoe.repositorioinstitucional.mx/jspui/handle/1009/2120| Return Loss and Crosstalk Mitigation in Coupled Vias for Modern High-Speed Packaging | |
| Gaudencio Hernández Sosa Reydezel Torres Torres | |
| Acceso Abierto | |
| Atribución-NoComercial-SinDerivadas | |
| Coupled vias Physics-based circuit model Return loss Crosstalk High-speed Interconnec | |
| A method for mitigating the return loss and crosstalk corresponding to coupled vias is presented in this article. The method is based on selecting the proper dimensions for the antipad holes related to vias as well as the most adequate distribution of the ground vias, which allows to simultaneously reducing impedance mismatch and undesirable via coupling. The usefulness of the method is demonstrated by improving the performance of a 2 x 3 arrayof six signal vias. As a result, return loss levels below -45 dB and crosstalk levels below -40 dB are obtained in the 0–50 GHz frequency range. © 2011 Wiley Periodicals, Inc. Int J RF and Microwave CAE 22:224–234, 2012. | |
| International Journal of RF and Microwave Computer-Aided Engineering | |
| 2012-03 | |
| Artículo | |
| Inglés | |
| Estudiantes Investigadores Público en general | |
| Hernandez-Sosa, Gaudencio, et al., (2012), Return Loss and Crosstalk Mitigation in Coupled Vias for Modern High-Speed Packaging, International Journal of RF and Microwave Computer-Aided Engineering, Vol. 22(2):224–234 | |
| ELECTRÓNICA | |
| Versión aceptada | |
| acceptedVersion - Versión aceptada | |
| Aparece en las colecciones: | Artículos de Electrónica |
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| 67 Torres_2012_Engineering22-2.pdf | 1.67 MB | Adobe PDF | Visualizar/Abrir |