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Modeling Resonances in Transmission Lines Fabricated Over Woven Fiber Substrates
Reydezel Torres Torres
Acceso Abierto
Atribución-NoComercial-SinDerivadas
Fiber weave
Interconnect
Printed circuit board (PCB)
Resonances
This paper models transmission lines (TLs) fabricated over a printed circuit board substrate made of woven fiber fabric that causes resonances in the insertion and return loss. The modeling relies on the fact that these lines can be analyzed as periodically loaded TLs. Here, a method to determine the associated equivalent propagation constant and characteristic impedance is proposed. This allows to accurately reproduce the 𝑆-parameters for a TL of arbitrary length and for any periodicity of the fiber weave pattern along the line requiring neither multi-staged equivalent circuits, nor full-wave simulations.
IEEE Transactions on Microwave Theory and Techniques
2013-07
Artículo
Inglés
Estudiantes
Investigadores
Público en general
Torres-Torres, Reydezel, et al., (2013), Modeling Resonances in Transmission Lines Fabricated Over Woven Fiber Substrates, IEEE Transactions on Microwave Theory and Techniques, Vol. 61(7):2558-2565
ELECTRÓNICA
Versión aceptada
acceptedVersion - Versión aceptada
Aparece en las colecciones: Artículos de Electrónica

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